探頭和附件
所有BondMaster™ 1000e+ 探頭都具備PowerLink™ 功能。這些探頭包括一發(fā)一收(S-PC)、MIA(S-MP)、諧振(S-PR)探頭。 BondMaster PC 界面軟件：可使數(shù)據(jù)傳輸?shù)絇C***。
Probes
Pitch-Catch mode uses high-frequency sound waves to transmit surface waves into the test part. A separate receiving element, a set distance from the transmitter, picks up the energy transmitted into the material. The sound waves are carried in a plate-wave mode across the test piece between the two probe tips.
Part Code
Item Number
Description
9317797
U8010012
S-PC-P11: Spring-loaded tips, 17 mm (0.67 in.) tip spacing, low voltage
9322074
U8770334
S-PC-P12: Fixed tips, 17 mm (0.67 in.) tip spacing, high voltage
9322076
U8770336
S-PC-P13: Spring-loaded tips, 17 mm (0.67 in.) tip spacing, high voltage
9323945
U8800601
S-PC-P14: Spring-loaded tips, 15 mm (0.59 in.) tip spacing, high voltage
9323954
U8629399
S-PC-P15: Spring-loaded tips, 13mm (0.51 in.) tip spacing, high voltage
9323952
U8010062
S-PC-P16:Spring-loaded tips, 15 mm (0.59 in.) tip spacing, high voltage
9322184
U8010039
SPO-5629-PHV: Spring-loaded tips, 13 mm (0.51 in.) tip spacing, high voltage.
9323942
U8010054
S-PC-DHV: Differential High Voltage, four spring-loaded tips
MIA Probes
The Mechanical Impedance Analysis (MIA) test mode uses a single-tipped dual-element probe. A drive element generates sound waves and a receive element detects the effect of the structure on probe-tip loading.
Part Code
Item Number
Description
9317806
U8010013
S-MP-1: Right angle probe, 12.7 mm (0.5 in.) tip diameter.
9317807
U8010014
S-MP-2: Straight probe, 6.35 mm (0.25 in.) tip diameter.
9317796
U8010011
S-MP-3: Right angle probe, 12.7 mm (0.5 in.) tip diameter.
9317808
U8010015
S-MP-4: Right angle probe, 6.35 mm (0.25 in.) tip diameter.
9322075
U8770335
S-MP-5: Right angle probe, 12.7 mm (0.5 in.) tip diameter.
Resonance Probes
The Resonance mode contact transducer is driven at its resonant frequency and coupled to the sample using a low-viscosity couplant. Impedance changes in the sensor are analyzed to detect changes in the test sample.
Part Code
Item Number
Description
9317809
U8010016
S-PR-1: 35 kHz (±5 kHz) in a 15.9 mm (0.63 in.) diameter case
9317810
U8010017
S-PR-2: 65 kHz (±10 kHz) in a 15.9 mm (0.63 in.) diameter case
9317793
U8010008
S-PR-3: 110 kHz (±10 kHz) in a 15.9 mm (0.63 in.) diameter case
9317794
U8010009
S-PR-4: 165 kHz (±10 kHz) in a 12.7 mm (0.5 in.) diameter case
9317795
U8010010
S-PR-5: 250 kHz (±10 kHz) in a 9.5 mm (0.37 in.) diameter case
9317811
U8010018
S-PR-6: 330 kHz (±10 kHz) in a 9.5 mm (0.37 in.) diameter case
Kits
Part Code
Item Number
Description
BM-KIT-PC1
U8010069
BondMaster Probe and Standard Kit for Pitch-Catch Inspections
Contains: NEC-6407 Reference Standard with S-PC-P14 Pitch-Catch Probe and Cable
BM-KIT-PC2
U8010070
BondMaster Probe and Standard Kit for Pitch-Catch Inspections
Contains: NEC-6407 Reference Standard with S-PC-P14 and SPO-5629PHV Pitch-Catch Probes and Cable
BM-KIT-MIA
U8010071
BondMaster Probe and Standard Kit for MIA Inspections
Contains: NEC-6407 Reference Standard with S-MP-3 MIA Probe and BMM-H Spring Holder and Cable
BM-KIT-RES-C
U8010072
BondMaster Probe and Standard Kit for Resonance Inspections
Contains: NEC-6382 Composite Reference Standard with S-PR-4 Resonance Probe, Couplant and Cable
BM-KIT-RES-A
U8010073
BondMaster Probe and Standard Kit for Resonance Inspections
Contains: NEC-6384 Aluminum Reference Standard with S-PR-4 Resonance Probe, Couplant and Cable
BM-KIT-PMR
U8010074
BondMaster Probe and Standard Kit for Pitch-Catch, MIA and Resonance Inspections
Contains: NEC-6407 Reference Standard, S-PC-P14 and SPO-5629PHV Pitch-Catch Probes, S-MP-3 MIA Probe with BMM-H Spring Holder, NEC-6382 Composite Reference Standard, NEC-6384 Aluminum Reference Standard, S-PR-4 Resonance Probe, Couplant and Cables
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